EPALLOY 7192 is an unmodified, high molecular weight Bisphenol A based epoxy resin that is a semi-solid material at room temperature. It is particularly well suited for use in formulating durable high solids coatings, toughened adhesives, laminating resins, and prepreg molding compounds. As compared to lower molecular weight epoxy resins it will provide faster cure, improved adhesion, more durable cured systems and toughness, with somewhat reduced high temperature performance.

EPALLOY 7192 is suitable for blending with most other epoxy resins but may not be compatible with all modifiers or additives. It will react with most standard curing agents such as aliphatic and cycloaliphatic amines, amine adducts, polyamides, and amidoamines. Certain curing agents will require a short induction time after mixing and before application in order to allow compatibilization and to prevent surface defects such as blushing in coatings.

It is recommended that EPALLOY 7192 be heated to a temperature of approximately 150°F to facilitate handling, dispensing and mixing.

Typical Properties Values
EEW, g/eq 230-280
Viscosity, cps Gardner-Holdt,O-V(70% solids in Butyl Carbitol)
Color, Max 3 (Gardner)
Hydrolyzable Chloride, Max % 0.10
Weight per Gallon, @25°C lbs. 9.7

To obtain a Safety Data Sheet (SDS) please contact Global_Product_EHS_AdMat@huntsman.com

Application Group Application Description
Adhesives Structural General Purpose Industrial Adhesives High performance resin for improved adhesion.
- Automotive Sound Damping Base resin in Sound Damping.