ERISYS® GE-11
ERISYS GE-11, epoxidized para-tertiary butyl phenol, is an aromatic mono-epoxide. GE-11 is intended for use as a reactive diluent for high viscosity epoxy resins and it is compatible at all concentrations with those resins. Resin/diluent blends can be cured using any curing agent for epoxy resins. GE-11, due to its aromatic structure, is not as efficient in viscosity reduction as aliphatic diluents ERISYS GE-5, GE-6, GE-7, or GE-8. However, performance properties of epoxy formulations diluted with GE-11 are modified less than those of systems containing the aliphatic monofunctional diluents. Depending on concentration, properties such as gel time, room temperature strength, and modulus of a GE-11 diluted formulation remain relatively unchanged compare to an undiluted resin. However, a decline in elevated temperature performance, as indicated by decreasing Tg with increasing GE-11 concentration occurs. Cured formulations containing GE-11 exhibit excellent moisture resistance. ERISYS GE-11’s low vapor pressure, low odor and exceptionally low residual epichlorohydrin level make it ideally suited for environmentally difficult applications. Another feature of GE-11 is its ability to reduce the tendency of certain epoxy resins to crystallize, thereby producing formulations with improved homogeneity.

Typical Properties | Values |
---|---|
EEW, g/eq | 215-240 |
Viscosity, cps | 20-30 @25°C |
Color, Max | 1 (Gardner) |
Hydrolyzable Chloride, Max % | 0.10 |
Residual Epichlorohydrin, max ppm | 10 |
Weight per Gallon, @25°C lbs. | 8.5 +/- 0.1 |
Flash Point, °C (°F) | >121 (250) |
Water, % Max | 0.1 |
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Application Group | Application | Description |
---|---|---|
Coatings | Construction Flooring | Reactive diluent in floor coatings. |
Electrical and Electronics | Electronics Encapsulants | Reactive diluent in Potting and Encapsulation. |