OMICURE DDA 10 is a micronized grade of Dicyandiamide, a solid latent curing agent for epoxy resins. It has a mean particle size of approximately 12µ and is one of several grades of Dicyandiamide offered by CVC that differ on particle size. OMICURE DDA 10 contains approximately 2% silica as an anti-caking aid.
OMICURE DDA 10, like other grades of Dicy, is dispersed into a resin system where it remains stable until activated by heat. Without an accelerator, such as a substituted urea, dicyandiamide has an activation temperature of about 350°F and a formulated storage stability of over six months. When catalyzed with a latent accelerator, like one of the OMICURE U series of substituted ureas, one component adhesive and sealant formulas can be prepared with cure temperature of 250°F and excellent stability. The fine particle size of OMICURE DDA 10 will help aid good dispersion, prevent settling, and promote uniform cure to formulated systems without worry of ‘hot spots’.
Epoxy systems cured with OMICURE DDA 10 are characterized by outstanding adhesion making it a preferred choice for adhesive formulations. OMICURE DDA 10 is compatible with all epoxy resins, including Bisphenol A and F epoxies and epoxy novolacs, can be used with diluted or undiluted resins, and is compatible with a wide variety of fillers and pigments. OMICURE DDA 10 is safe to handle and is considered non-toxic.
|Mean Particle Size||12µ|
|Moisture Content (loss @ 105°C) max %||0.7|
|Onset Melting Point, °C||207-212|
|Appearance||White crystalline powder|
|Typical Flow Control Content, %||1.5 to 2.5|
To obtain a Safety Data Sheet (SDS) please contact Global_Product_EHS_AdMat@huntsman.com
Product Brochure & Line Card
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