OMICURE^® DDA5

OMICURE^® DDA5

OMICURE DDA 5 is an ultra-micronized grade of Dicyandiamide, a solid latent curing agent for epoxy resins. It has a mean particle size of approximately 4μ and is one of several grades of Dicyandiamide offered by CVC that differ on particle size. OMICURE DDA 5 contains approximately 2-3% silica as an anti-caking aid. OMICURE DDA 5, like other grades of Dicy, is dispersed into a resin system where it remains stable until activated by heat. Without an accelerator, such as a substituted urea, dicyandiamide has an activation temperature of about 350°F and a formulated storage stability of over six months. When catalyzed with a latent accelerator, like one of the OMICURE U series of substituted ureas, one component adhesive and sealant formulas can be prepared with cure temperature of 250°F and excellent stability. The ultra-fine particle size of OMICURE DDA 5 will help to aid good dispersion, prevent settling, maximize reactivity, promote uniform cure to formulated systems, and avoid issues of ‘hot spots’. Epoxy systems cured with OMICURE DDA 5 are characterized by outstanding adhesion making it a preferred choice for adhesive formulations. OMICURE DDA 5 is compatible with all epoxy resins, including Bisphenol A and F epoxies and epoxy novolacs, can be used with diluted or undiluted resins, and is compatible with a wide variety of fillers and pigments. OMICURE DDA 5 is safe to handle and is considered non-toxic.