OMICURE U-410M, an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. The addition of OMICURE U-410M to epoxy/dicy formulations reduces the time and/or temperature required to cure these shelf stable one part products.

Compared to the other CVC substituted ureas, toluene bis dimethyl urea provides the greatest degree of acceleration to epoxy/dicy formulations. However, some sacrifice in room temperature shelf life may occur. At concentrations required to provide an equal degree of acceleration, (versus other CVC substituted ureas), toluene bis dimethyl urea, produces the least effect on Tg.

OMICURE U-410M is a mixed isomer grade of OMICURE U-24 and is somewhat less expensive. DGEBA/DICY formulations accelerated with equal amounts of either of these products will have similar room temperature shelf lives. However, those containing U-410M will cure faster, with possibly a slight decrease in Tg. Suggested use levels of OMICURE U-410M are < 5 phr. Curing can be accomplished in about 30 minutes at 100°C and in about 3 minutes at temperatures > 150°C. Cure times are dependent on the composition of the formulated product and the particular end applications.
Room temperature shelf lives (time to double viscosity) of >3 months can be obtained when < 1 phr OMICURE U-410M is used with DGEBA/DICY. Some of the factors which can effect shelf life are formulation ingredients and compounding parameters. Ingredients in which OMICURE U-410M is insoluble at processing and storage temperatures will enhance overall storage stability. OMICURE U-410M can be incorporated into your formulation concurrent with the dicy addition.

Typical Properties Values
Particle Size, min. % through a 325 mesh screen 95
Moisure Content, Max 1.0
Melting Point, °C 180 - 195
Color Off White
Appearance White Powder

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Application Group Application Description
Coatings Industrial Fusion Bonded Pipe Coatings Provides better UV stability, faster cure and less brittleness when compared to Imidazol systems.