OMICURE® U415M
OMICURE U-415M, an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. The addition of OMICURE U-415M to epoxy/dicy formulations produces shelf stable one part products which cure in shorter times and/or at lower temperatures.
Suggested use levels of OMICURE U-415M in DGEBA/DICY are 1-3 phr. At these levels curing can be accomplished in about eighty minutes at 100°C and in less than five minutes at temperatures > 150°C. Cure times and shelf lives are dependent on the composition of the formulated product and your particular end application. Some of the factors which can effect shelf life are formulation ingredients and compounding parameters. Ingredients in which OMICURE U-415M is insoluble at processing and storage temperatures will enhance overall storage stability. OMICURE U-415M can be incorporated into your formulation concurrent with the dicy addition.
Of the CVC substituted ureas, methylene bis (phenyl dimethyl urea) provides the best combination of acceleration, long shelf life and maintenance of cured properties in dicy cured DGEBA. However, formulations containing U-415 have shorter room temperature shelf lives and cure somewhat slower than those containing OMICURE U-52.
Suggested use levels of OMICURE U-415 in DGEBA/DICY are < 5 phr. At these levels curing can be accomplished in about eighty minutes at 100°C and in less than five minutes at temperatures > 150°C. Cure times and shelf lives are dependent on the composition of the formulated product and your particular end application. Some of the factors which can effect shelf life are formulation ingredients and compounding parameters. Ingredients in which OMICURE U-415 is insoluble at processing and storage temperatures will enhance overall storage stability. OMICURE U-415 can be incorporated into your formulation concurrent with the dicy addition.

Typical Properties | Values |
---|---|
Particle Size, min. % through a 325 mesh screen | 95 |
Moisure Content, Max | 0.7 |
Melting Point, °C | 190 - 220 |
Color | Off White |
Appearance | White Powder |
To obtain a Safety Data Sheet (SDS) please contact Global_Product_EHS_AdMat@huntsman.com
TDS
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Application Group | Application | Description |
---|---|---|
Adhesives | Automotive Mastics | Urea Accelerator for 1K latent systems. Reduces curing temperature. |
Adhesives | Automotive Injection Molded Structural Parts | Urea Accelerator for 1K latent systems. Reduces curing temperature. |
Adhesives | Industrial Structural Adhesives | Urea Accelerator reducing curing temperature. |
Composites | Advanced Composite Prepregs | Urea Accelerator reducing curing temperature. |